JPH0126157Y2 - - Google Patents

Info

Publication number
JPH0126157Y2
JPH0126157Y2 JP19854082U JP19854082U JPH0126157Y2 JP H0126157 Y2 JPH0126157 Y2 JP H0126157Y2 JP 19854082 U JP19854082 U JP 19854082U JP 19854082 U JP19854082 U JP 19854082U JP H0126157 Y2 JPH0126157 Y2 JP H0126157Y2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
integrated circuit
shield
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19854082U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59107195U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19854082U priority Critical patent/JPS59107195U/ja
Publication of JPS59107195U publication Critical patent/JPS59107195U/ja
Application granted granted Critical
Publication of JPH0126157Y2 publication Critical patent/JPH0126157Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP19854082U 1982-12-30 1982-12-30 プリント配線基板回路装置 Granted JPS59107195U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19854082U JPS59107195U (ja) 1982-12-30 1982-12-30 プリント配線基板回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19854082U JPS59107195U (ja) 1982-12-30 1982-12-30 プリント配線基板回路装置

Publications (2)

Publication Number Publication Date
JPS59107195U JPS59107195U (ja) 1984-07-19
JPH0126157Y2 true JPH0126157Y2 (en]) 1989-08-04

Family

ID=30424105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19854082U Granted JPS59107195U (ja) 1982-12-30 1982-12-30 プリント配線基板回路装置

Country Status (1)

Country Link
JP (1) JPS59107195U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9958411B2 (en) 2006-10-19 2018-05-01 Panasonic Healthcare Holdings Co., Ltd. Method for measuring hematocrit value of blood sample, method for measuring concentration of analyte in blood sample, sensor chip and sensor unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023121391A (ja) * 2022-02-21 2023-08-31 株式会社Jvcケンウッド 放熱器固定構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9958411B2 (en) 2006-10-19 2018-05-01 Panasonic Healthcare Holdings Co., Ltd. Method for measuring hematocrit value of blood sample, method for measuring concentration of analyte in blood sample, sensor chip and sensor unit

Also Published As

Publication number Publication date
JPS59107195U (ja) 1984-07-19

Similar Documents

Publication Publication Date Title
JP3619670B2 (ja) 電子機器
US5053924A (en) Electromagnetic shield for electrical circuit
US6205028B1 (en) Circuit substrate including printed circuit board having heat-shielding portion
KR910015207A (ko) 인쇄 회로판의 표면상에 실장할 수 있는 전자 부품의 구조물 및 이의 실장 방법
JPH0126157Y2 (en])
JP2001160608A (ja) 電子機器ユニットにおける発熱部品の放熱構造
JP3956516B2 (ja) プリント基板の実装構造
KR100286466B1 (ko) 전자기기
JP2793568B2 (ja) 電子部品の放熱構造
JPH05259670A (ja) プリント配線板構造体
JP2003318579A (ja) 放熱板付きfetの放熱方法
JP2684893B2 (ja) 混成集積回路装置
JPH0439957A (ja) 半導体パッケージの放熱具
JPH07336009A (ja) 半導体素子の放熱構造
JPH0638479Y2 (ja) 電子部品のシールドケース
JPH03132059A (ja) Icの実装方法
JP2775809B2 (ja) 半導体チップキャリア
JPH0349433Y2 (en])
JPH03177095A (ja) 電子部品の放熱方法
JPH04359586A (ja) 印刷配線基板
JPH04286397A (ja) 混成集積回路装置
JPH05326091A (ja) 放熱機構を備えたicソケット及び多層プリント基板
JP2003243549A (ja) 電子装置
JP3685399B2 (ja) 基板に実装されるアキシャル部品の放熱構造
JPH09172114A (ja) 半導体フラットパッケージ